 Early Times Report
JAMMU, May 14: Prof. Eswaramoorthy Muthusamy, School of Mechanical Engineering, Shri Mata Vaishno Devi University (SMVDU), presented his research on Thermal Management in Modern Electronics at the international conference on "Recent Trends in Mechanical Engineering". The conference, organized by the Department of Mechanical Engineering [NBA Accrediated], College of Engineering Adoor, Govt of Kerala, esteemed domain experts, researchers, and professionals from around the world, including National Taiwan University; University of Warwick, UK; Indian Institute of Space Science and Technology, Thiruvananthapuram.; University of Technology and Applied Sciences, Muscat, Oman; Oak Ridge National Laboratory, Tennessee, USA; Heriot-Watt University, Edinburgh; Robert Bosch, Germany; Coventry University, UK., IIT Madras, IIT Mumbai , NIT-T, NIT-K, were present among others. Prof. Eswaramoorthy Muthusamy's research paper titled "Recent Development in Thermal Management of Modern Electronics Devices" explores the review on thermal management in electronic devices, various strategies adopted for thermal management, and impacts on its reliability and life spans. The study highlights the comprehensive review on status, state of the art in thermal management in electronic devices and research challenges and future scope for further studies.As electronic devices become smaller and more powerful, effective thermal management has become essential to maintain performance, prevent overheating, and extend device lifespan. Recent advancements focus on innovative materials, miniaturized cooling technologies, and intelligent systems. Key developments include: Advanced Materials- High thermal conductivity substances like graphene, carbon nanotubes (CNTs), and phase change materials (PCMs) are being used to improve heat transfer and storage. Micro/Nanoscale Cooling- Technologies such as microchannel heat sinks, nanofluids, and thermoelectric coolers enable compact and efficient heat removal from localized hotspots. Passive and Active Cooling Techniques- Improved thermal interface materials (TIMs), vapor chambers, and active liquid cooling systems provide better thermal control for high-performance devices. AI-Driven Thermal Management- Integration of artificial intelligence and smart sensors allows dynamic, real-time regulation of temperature based on workload and environmental conditions. Emerging Trends- flexible thermal solutions for wearable tech, and integration with energy-efficient systems is gaining momentum. These developments aim to ensure reliability, efficiency, and sustainability in the next generation of electronic systems. The technical presentation brought great attention and discussion to flexible phase change materials and phase change materials to minimize the overheating which causes failure of modern electronic devices. Dr. Eswaramoorthy Muthusamy has outreached the SMVDU's reputation in the interdisciplinary research domain of electronic devices of thermal management and academic excellence. Also, Prof. Eswaramoorthy has served as technical chair for a session to moderate the technical presentations. The conference was provided a platform for experts to share their research and insights, fostering a collaborative environment to address the recent trends in mechanical engineering. |
